Electronics Assembly

API offers a wide range of services supporting PCB assembly, box build (PCB subassembly or final product assembly), electromechanical assembly and full turnkey production. Manufacturing capabilities include:

  • High Speed SMT Board Assembly, Single and Double Sided 
  • Fine Pitch 0201 Component Placement 
  • BGA & Micro-BGA (Ball Grid Array) 
  • RoHS Compliant Assembly 
  • Mixed Technologies (SMT and Through-Hole) 
  • Box Build (Subassembly or Final Product Assembly) 
  • Electromechanical Assembly 
  • 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both 
  • Dedicated Program Management
  • In-process and Post-Assembly Verification (AOI, X-ray, Flying Probe, Functional and In-circuit Test) 

Next Steps

Recent Events

January 31, 2018 (All day) - February 2, 2018 (All day)
New Orleans
United States
The communications technology landscape is changing daily. IAUG CONVERGE provides the maps and tools you need to navigate it all. IAUG is coming to The Colorado Convention Center for five days of education, networking and innovation. No other event provides a more comprehensive program around integration, managed services, cost management, BYOD, cloud and more.
June 19, 2017 - June 21, 2017
Baltimore Convention Center & Hilton Hotel
United States
The Information Assurance Symposium (IAS) will take place from 19th June to the 21st June 2017 at the Baltimore Convention Center & Hilton Hotel. IAS is the premier NSA information assurance event, providing an opportunity for guests to learn and network from cyber security professionals, subject matter experts and solution providers from throughout Government, industry and academia.