Products.

Electronics Assembly

API offers a wide range of services supporting PCB assembly, box build (PCB subassembly or final product assembly), electromechanical assembly and full turnkey production. Manufacturing capabilities include:

  • High Speed SMT Board Assembly, Single and Double Sided 
  • Fine Pitch 0201 Component Placement 
  • BGA & Micro-BGA (Ball Grid Array) 
  • RoHS Compliant Assembly 
  • Mixed Technologies (SMT and Through-Hole) 
  • Box Build (Subassembly or Final Product Assembly) 
  • Electromechanical Assembly 
  • 100% Material Procurement, 100% Consigned Material Management, or a Mix of Both 
  • Dedicated Program Management
  • In-process and Post-Assembly Verification (AOI, X-ray, Flying Probe, Functional and In-circuit Test) 

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