Products.

Build to Print

API’s expertise covers state-of-the-art microelectronic techniques and technologies including:

  • Micro BGAs
  • Die bonding
  • Fluxless DAP Soldering
  • 1-3 mil Gold Ball Bonding
  • Automatic wedge bonding
  • Automated PCB assembly
  • In-house thin film fabrication
  • Fully automated over temperature testing

Explore Build to Print >