Spectrum Microwave

Die Bonding & Glob Top Dispensing

API  offers Primary Encapsulation, or Glob Top Dispensing, a Build to Print technique where a specific amount of resin is deposited over an open chip and its wire bonds.

Automated Element Attach

API's Build to Print Automated Element Attach capabilities focus on the same high quality process control that our ISO 9001:2000 certification demands.

Automated PCB Assembly

API's ability to achieve total vertical integration draws its success from our diverse group of more than 35 engineers dedicated to specialized areas of expertise such as microwave, electrical, process and mechanical.

Fluxless Soldering

Build to Print Fluxless Soldering by API, removes oxides from substrates and inhibits further oxidation insuring both intimate substrate-to-alloy contact and a secure bond.

Die Attach

API’s  void-free precision millimeter-wave bonding techniques maintains maximum die-to-substrate surface contact eliminating poor signal propagation found in less sophisticated semiconductor or MMIC die attachment methods.

Wire Bonding

API specializes in Wirebonding whether it be Automatic Gold Ball Bonding or Automatic Aluminum Wedge Bonding.  API also offers premier manual wire bonding using dependable wire ribbon techniques which other companies fail to include in their line-up.

Assemblies & Applications

API's vast knowledge, and experience, in advanced computer simulation, allowing us the ability to manufacture custom solutions and military hardened assemblies for any of your antenna assembly needs.

Wi-Fi Pro Dual Band Antennas

API has years of experience in the art and science of RF engineering, electrical engineering, materials science and state-of-the-art manufacturing and designs and builds custom application-specific antennas and antenna systems to meet specific customer needs.

Patch Antennas

API identifies critical issues such as the board layout, ground plane size, mounting methods, and port measurement, offering custom Patch Antennas to meet your unique needs.

Wearable Antennas

API designs and builds custom application-specific wearable antennas and antenna systems for both military and commercial markets.

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Recent Events

May 22, 2018 (All day) - May 24, 2018 (All day)
City:
Berlin
Country:
Germany
Join the Emcon team at NITEC 2017 as they showcase the latest developments in TEMPEST, rugged, and high security IT solutions for the government marketplace. Innovation has become more global, more rapid, and more concentrated in the private sector, where more commercial technologies than ever before have military applications. Panelists at NITEC will address these trends in depth; discuss how they are giving rise to new models of collaboration between defence organizations and Industry; and explore the implications for NATO.
May 15, 2018 (All day) - May 18, 2018 (All day)
Street:
3400 South Las Vegas Boulevard
City:
Las Vegas
,
Province:
Nevada
Postal Code:
89109
Country:
United States
EDS is the premier annual event for the main players in the international electronics industry. Every year, the manufacturers of electronic components, instruments and accessories, as well as distributors and manufacturer's representatives, come together to meet, make contacts and build their businesses. Suppliers of industry goods and services also are on hand to market their products. The emphasis at EDS is on forging and maintaining business relationships through scheduled, one-on-one meetings, but the event is also filled with important product exhibits educational, educational programs and networking opportunities.